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Grinding and polishing
During semiconductor wafer polishing, the process demands short polishing times, fast polishing rates, excellent surface quality, minimal impurity residues, and avoidance of any adverse effects on power device performance and overall yield. The silica sol features a uniform particle size distribution, ensuring a high concentration of effective abrasive particles that deliver rapid polishing speeds. Additionally, it boasts moderate hardness, outstanding dispersibility and flowability—preventing sedimentation or clumping that could lead to wafer scratches. At the same time, the silica sol exhibits high purity, low residue levels, and ease of cleaning, significantly reducing contamination-related issues on the wafer surface.
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